From flexible multi-stack horizontal furnaces to high-productivity 300mm vertical batch processors — engineered for uniformity, uptime and the lowest cost of ownership.
Optimized for flexibility, multiple simultaneous processes and efficient use of cleanroom space.
Flexible by Design
The TS 6/8 Series is a modern, modular horizontal furnace platform for 150mm and 200mm wafers. Up to four independently configurable process chambers can be tailored to different applications, delivering flexibility and high value within a compact footprint. The platform scales from R&D and pilot production to high-volume manufacturing, with configurations ranging from compact systems to extended flat-zone reactors. Automation options span assisted manual loading through fully automated wafer processing.
300mm Productivity at Scale
The TS 12 Series is a modern, modular horizontal furnace platform for 300 mm wafers. It supports up to six atmospheric process reactors and delivers excellent performance in high-temperature applications up to 1,250 °C. Choose from versatile two- or three-stack configurations with several automation options, or a fully automated six-reactor cluster designed to maximize productivity and cost-of-ownership performance.
Vertical batch furnaces for diffusion, oxidation and LPCVD, with small-footprint options for pilot lines and dual-boat platforms for high-volume production.
Scale as You Grow
The VS200 Series is a single-reactor vertical furnace designed for R&D and medium-volume production on 150 mm and 200 mm wafers, with batch sizes of 25–50 product wafers. It supports a broad range of diffusion and deposition processes. Its modular architecture can be configured to specific process and automation needs, enabling a cost-effective path from a compact manually loaded R&D tool to an automated production system capable of queuing multiple runs.
Purpose-Built for 300mm Curing
The VS300-C is a dual-reactor vertical furnace cluster designed specifically for 300 mm curing applications, with batch sizes of up to 75 product wafers. A shared front-end module serves both reactors within a modern, modular architecture. Atmospheric and reduced-pressure curing solutions are available for temperatures up to 400 °C. The platform is also designed to support co-development for specialized applications.
Versatility for 150–200mm
The AVP Ace is an advanced vertical batch furnace for 150 mm and 200 mm wafers. It delivers excellent process performance, optimized cost of ownership, and outstanding flexibility for diffusion, oxidation, and LPCVD applications. Building on proven process modules and an updated control architecture, the AVP Ace can be configured to meet specific production and engineering requirements.
Performance Across 200–300mm
The RVP Ace is a high-productivity vertical batch furnace for 200 mm and 300 mm wafers. It provides a flexible platform for diffusion, oxidation, and LPCVD processes, combining strong process performance with optimized cost of ownership. Proven process modules, updated controls, and flexible wafer-handling options enable the system to meet a wide range of production and engineering requirements.
Previous-generation vertical processors for 150–200mm wafers
These previous versions of the AVP Ace are vertical batch furnaces with a flexible platform for diffusion, oxidation and LPCVD processes. Available with single or dual boat configuration and batches up to 200 wafers. New AVP-8200 and RVP-9200 are available brand new and refurbished (subject to donor availability). Refurbished AVP-8000 and RVP-9000 are available subject to donor availability.
Previous-generation rapid vertical processors for 200–300mm wafers
Production-proven 300mm furnaces introduced in the world's first 300mm fab in 1999. Continuous refinement led to the RVP Ace. The layout provides for multiple systems with zero side spacing required due to innovative packaging, with excellent rear maintenance access. New RVP-300plus and RVP-550 are available brand new and refurbished (subject to donor availability).
A shared application set runs across the platform portfolio.
Tempress furnace platforms for medium and high-volume semiconductor manufacturing can be equipped with integrated boat handler and storage and fully automated cassette-to-cassette wafer handling systems. This reduces reliance on manual operator intervention while delivering a more stable and reliable process yield.
Factory-certified spares and upgrades are available for the Watkins-Johnson atmospheric CVD platforms: WJ-999 (3 process chambers for TEOS and hydride processes), WJ-1000 (4 process chambers for TEOS and hydride processes) and WJ-1500 (4 chambers for TEOS processes only).
The Watkins-Johnson systems are legacy platforms. They are not offered as new tools — we supply factory-certified spares, upgrades and service for the installed base.