Purpose-Built for 300mm Curing
The VS300-C is a dual-reactor vertical furnace cluster designed specifically for 300 mm curing applications, with batch sizes of up to 75 product wafers. A shared front-end module serves both reactors within a modern, modular architecture. Atmospheric and reduced-pressure curing solutions are available for temperatures up to 400 °C. The platform is also designed to support co-development for specialized applications.
An atmospheric diffusion process is a heat treatment in a mostly inert environment which distributes dopants in a silicon, GaAs, InP or other semiconductor wafer to a desired depth, changing the electrical properties of the semiconductor. Sometimes a reactive element such as oxygen is added, consuming silicon and converting it into silicon dioxide (SiO2) for use in many applications.
Tempress offers furnace solutions for various other processes such as wafer splitting (SOI/POI) and polyimide curing, and is open to customise and co-develop specific thermal processes to fit your needs.