Flexible by Design
The TS 6/8 Series is a modern, modular horizontal furnace platform for 150mm and 200mm wafers. Up to four independently configurable process chambers can be tailored to different applications, delivering flexibility and high value within a compact footprint. The platform scales from R&D and pilot production to high-volume manufacturing, with configurations ranging from compact systems to extended flat-zone reactors. Automation options span assisted manual loading through fully automated wafer processing.
An atmospheric diffusion process is a heat treatment in a mostly inert environment which distributes dopants in a silicon, GaAs, InP or other semiconductor wafer to a desired depth, changing the electrical properties of the semiconductor. Sometimes a reactive element such as oxygen is added, consuming silicon and converting it into silicon dioxide (SiO2) for use in many applications.
Low Pressure Chemical Vapor Deposition uses a chemical reaction to convert gas phase precursors into useful films. The products of that reaction are deposited on top of the wafer and therefore do not consume atoms from the base material.