Scale as You Grow
The VS200 Series is a single-reactor vertical furnace designed for R&D and medium-volume production on 150 mm and 200 mm wafers, with batch sizes of 25–50 product wafers. It supports a broad range of diffusion and deposition processes. Its modular architecture can be configured to specific process and automation needs, enabling a cost-effective path from a compact manually loaded R&D tool to an automated production system capable of queuing multiple runs.
An atmospheric diffusion process is a heat treatment in a mostly inert environment which distributes dopants in a silicon, GaAs, InP or other semiconductor wafer to a desired depth, changing the electrical properties of the semiconductor. Sometimes a reactive element such as oxygen is added, consuming silicon and converting it into silicon dioxide (SiO2) for use in many applications.
Low Pressure Chemical Vapor Deposition uses a chemical reaction to convert gas phase precursors into useful films. The products of that reaction are deposited on top of the wafer and therefore do not consume atoms from the base material.
Tempress offers furnace solutions for various other processes such as wafer splitting (SOI/POI) and polyimide curing, and is open to customise and co-develop specific thermal processes to fit your needs.